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Diamond / CBN - Resin bonded - Tool and Cutter - Creepfeed grinding
Creepfeed grinding of solid carbide tools
Flutes of milling cutters and drill bits can be ground in one pass straight into the solid tool blank rather than using a reciprocating process, with many passes at a low depth of cut. In order to make this creepfeed process possible, a new induced porosity resin bond called "MH3" was developed. The MH3 bond can be dressed relatively easily. It features sufficient chip space for effective cooling and chip removal. The difference between reciprocation and creepfeed grinding is illustrated below:

Operating parameters
Depth of cut ae : 1 to 8 mm per pass (0.04 to 0.3 inch)
Feed rate Vfa: 20 to 120 mm/min (3/4 6 inch/min)

The deeper the cut, the lower the feed rate. The overall material removal rate Ow' must be closely observed.
Ow' = ae * vfa / 60 
 
 











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